Boundary-Scan Test A Practical Approach

chasing · 发表于 2016-9-14 18:01:53

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本帖最后由 chasing 于 2016-9-20 16:19 编辑

This book will act as an introduction as well as a practical guide to
Boundary-Scan Testing. The ever increasing miniaturization of digital
electronic components is hampering the conventional testing of Printed
Circuit Boards (PCBs). Basically the very high scale of IC integration, with
packages containing hundreds of pins at very small pitches down to a
fraction of a millimeter, has made conventional testing impractical due to a
lack of physical test access. Moreover Boundary-Scan will be applied in
areas where test access will be a critical parameter such as Multi Chip
Modules, waferscale integration and system testing.
Following the evolution in IC test technology, Boundary-Scan Testing has
become the new approach to PCB testing, and to other test access
constrained assemblies. By taking precautions in the IC design (design for
testability), testing at PCB level could be simplified to a great extent.
This condition has been essential for the success of the introduction of
Boundary-Scan Testing at board level.
Since Boundary-Scan Testing involves the whole product life cycle, it is
more than just the introduction of a new design technology.The benefits of
Boundary-Scan such as time-to-market reduction, cost savings and quality
improvement are discussed. It is an integral product approach which will
support top management in their goal of achieving a successful global
strategy for their business.
This book aims to aid companies that are introducing Boundary-Scan Test.
IC design and test engineers alike will find the book an important
introduction and guide to using Boundary-Scan Test in their work.
Engineering managers can use this book to gain an insight at the impact
that Boundary-Scan Test will make on their organisation.

This book will act as an introduction as well as a practical guide to
Boundary-Scan Testing. The ever increasing miniaturization of digital
electronic components is hampering the conventional testing of Printed
Circuit Boards (PCBs). Basically the very high scale of IC integration, with
packages containing hundreds of pins at very small pitches down to a
fraction of a millimeter, has made conventional testing impractical due to a
lack of physical test access. Moreover Boundary-Scan will be applied in
areas where test access will be a critical parameter such as Multi Chip
Modules, waferscale integration and system testing.
Following the evolution in IC test technology, Boundary-Scan Testing has
become the new approach to PCB testing, and to other test access
constrained assemblies. By taking precautions in the IC design (design for
testability), testing at PCB level could be simplified to a great extent.
This condition has been essential for the success of the introduction of
Boundary-Scan Testing at board level.
Since Boundary-Scan Testing involves the whole product life cycle, it is
more than just the introduction of a new design technology.The benefits of
Boundary-Scan such as time-to-market reduction, cost savings and quality
improvement are discussed. It is an integral product approach which will
support top management in their goal of achieving a successful global
strategy for their business.
This book aims to aid companies that are introducing Boundary-Scan Test.
IC design and test engineers alike will find the book an important
introduction and guide to using Boundary-Scan Test in their work.
Engineering managers can use this book to gain an insight at the impact
that Boundary-Scan Test will make on their organisation.

论坛上有人上传过这本书，无奈分开2个部分缺无法解压。所以特意从国外网站下载下来，方便大家阅读。
另外推荐一本书《THE BOUNDARY-SCAN HANDBOOK SECOND EDITION Analog and Digital》。论坛上已经有资源了，所以不再重复分享。