3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Jason.tschen

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
by Ibrahim M. Elfadel, Gerhard Fettweis
Hardcover: 339 pages
Publisher: Springer; 1st ed. 2016 edition (May 11, 2016)
Language: English
ISBN-10: 3319204807
ISBN-13: 978-3319204802

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

&#8226rovides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems;
•Explains the use of wireless 3D integration to improve 3D IC reliability and yield;
•Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
•Includes discussion of 3D integration of high-density power sources and novel NVM.

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