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[求助] Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

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发表于 2013-11-21 18:36:16 | 显示全部楼层 |阅读模式

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请问有没有Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs?
谢谢!


Noia, Brandon, Chakrabarty, Krishnendu

Springer

2014, XVIII, 245 p. 133 illus., 115 illus. in color.

Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs
Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations
Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective


This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects.  The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain.  Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization.  Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

• Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs;
• Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations;
• Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.
发表于 2013-11-24 13:31:04 | 显示全部楼层
http://link.springer.com/book/10.1007%2F978-3-319-02378-6
发表于 2013-11-25 13:49:08 | 显示全部楼层
did who share the book?
 楼主| 发表于 2014-2-14 16:34:24 | 显示全部楼层
http://www.ebookee.net/Design-for-Test-and-Test-Optimization-Techniques-for-TSV-based-3D-Stacked-ICs_2481685.html
试了一下, 下不了.
发表于 2015-1-18 10:30:03 | 显示全部楼层
i am also looking for it
发表于 2022-5-6 01:20:37 | 显示全部楼层
any update ?
发表于 2022-5-6 09:53:29 | 显示全部楼层
同求
发表于 2022-5-6 10:28:33 | 显示全部楼层
here you are as requested

SP-DFT-TSV-3D-Stacking.pdf

6.59 MB, 下载次数: 13 , 下载积分: 资产 -3 信元, 下载支出 3 信元

发表于 2022-5-17 23:15:40 | 显示全部楼层
找到一个老版本

009_Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked IC.pdf

5.02 MB, 下载次数: 8 , 下载积分: 资产 -3 信元, 下载支出 3 信元

发表于 2022-5-19 14:25:04 | 显示全部楼层
tks a lot
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