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Wiley.IEEE.Press. TESTING FOR EMC COMPLIANCE Approaches and Techniques

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发表于 2008-9-15 23:31:14 | 显示全部楼层 |阅读模式

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推荐一本好书 TESTING FOR EMC COMPLIANCE  Approaches and Techniques

是电子版,不是扫描版,所以不用担心清晰度的问题

TESTING FOR EMC COMPLIANCE  Approaches and Techniques
         MARK I. MONTROSE
         EDWARD M. NAKAUCHI

IEEE Electromagnetic Compatibility Society, Sponsor

A JOHN WILEY & SONS, INC., PUBLICATION


Preface xiii
Acknowledgments xvii


1 Introduction
1.1 The Need to Comply
1.2 Definitions
1.3 Nature of Interference
1.4 Overview on Product Testing
1.4.1 Test Environment
1.4.2 Self-Compatibility
1.4.3 Validation of Measured Data
1.4.4 Problems during Emissions Testing
1.5 Time-Domain versus Frequency-Domain Analysis
1.6 EMC Testing Methodologies
1.6.1 Development Testing and Diagnostics
1.6.2 Compliance and Precompliance Testing
References
2 Electric, Magnetic, and Static Fields
2.1 Relationship between Electric and Magnetic Fields
2.2 Methods of Noise Coupling
2.2.1 Common-Impedance Coupling
2.2.2 Electromagnetic Field Coupling
2.2.3 Conductive Coupling
2.2.4 Radiated Coupling–Magnetic Field
2.2.5 Radiated Coupling–Electric Field
2.2.6 Radiated and Conducted Coupling Combined
2.3 Common-Mode Currents versus Differential-Mode Currents
2.3.1 Differential-Mode Currents
2.3.2 Common-Mode Currents
2.3.3 Example on Difference between Differential- and  
Common-Mode Currents
2.3.4 Radiation due to Differential-Mode Currents
2.3.5 Common-Mode Radiation
2.3.6 Conversion between Differential- and  
Common-Mode Energy
2.4 Static Fields
2.4.1 Electrostatic Discharge Waveforms
2.4.2 Triboelectric Series
2.4.3 Failure Modes From a Static Event
References
3 Instrumentation
3.1 Time-Domain Analyzer
3.1.1 Oscilloscope Probes
3.2 Frequency-Domain Analyzers
3.2.1 Spectrum Analyzers
3.2.2 Receivers
3.3 Precompliance versus Compliance Analyzers
3.4 Correlation Analyzer
3.4.1 Characteristics of Cancellation System
3.4.2 Coherence Factor
References
4 Test Facilities
4.1 Open-Area Test Sites
4.1.1 Requirements for an OATS
4.1.2 Test Configuration—System, Power, and  
Cable Interconnects
4.1.3 Operating Conditions
4.1.4 Measurement Precautions
4.1.5 Alternate Test Sites
4.2 Chambers
4.2.1 Anechoic Chamber
4.2.2 Screen/Shield Rooms
4.2.3 Reverberation Chamber
4.3 Cells
4.3.1 TEM Cell
4.3.2 GTEM Cell
References
5 Probes, Antennas, and Support Equipment
5.1 Need for Probes, Antennas, and Support Equipment
5.2 Voltage Probes
5.3 Current Probes
5.3.1 Specifying a Current Probe
5.3.2 Limitations When Using Current Probes
5.4 LISN/AMN (AC Mains)
5.5 CDNs (Data and Signal Lines)
5.6 Absorbing Clamp
5.6.1 Test Setup and Measurement Procedure
5.7 Bulk Current Injection—Probe and Insertion Clamp
5.7.1 Choosing a BCI Probe
5.8 Basic Probe Types—Near Field and Closed Field
5.9 Sniffer Probes
5.9.1 Near-Field Probes
5.9.2 Commercial Probes
5.10 Differential-Mode Probes
5.11 Home-Made Probes
5.12 Alternate Troubleshooting Devices
5.13 Far-Field Antennas
5.13.1 Common Antennas Used for EMC Testing
References
6 Conducted Testing
6.1 Overview of Conducted Currents
6.1.1 Common- and Differential-Mode Currents on Wires  
and Cables
6.1.2 Coupling Paths for Conducted Emissions
6.1.3 Conducted Emissions Test Requirements
6.2 Performing Conducted Current Tests
6.2.1 Engineering Investigation in Laboratory or  
Engineer’s Office
6.2.2 Test Environment
6.3 Conducted Emissions Testing (AC Power Mains)
6.3.1 Potential Problems during Conducted Emission Testing
6.3.2 In Situ Testing of Systems and Installations
6.4 Immunity/Susceptibility Tests
6.4.1 Electrical Fast Transient and Burst Testing
6.4.2 Surges
6.4.3 Conducted RF Current Immunity
6.4.3.1 Coupling Methods
6.4.3.2 Typical Conducted Immunity Test Setup  
and Equipment
6.4.3.3 Performing Typical Conducted Immunity Test
6.4.3.4 Diagnosis and Fixes
6.4.4 AC Mains Supply Dips, Dropouts, and Interruptions
6.4.4.1 AC Mains Supply Sags/Brownouts
6.4.4.2 Swell Testing
6.4.4.3 Three-Phase Equipment—Compliance Testing
6.4.4.4 Diagnosis and Fixes
6.4.5 Power Line Harmonics
6.4.5.1 How Harmonics Are Created and Related  
Concerns
6.4.5.2 Diagnosis and Fixes
6.4.6 Voltage Fluctuation and Flicker
6.4.6.1 Description of Short-Term Flicker
6.4.6.2 Instrumentation
References
7 Radiated Testing
7.1 Performing Radiated Tests
7.1.1 Engineering Investigation in Laboratory or  
Engineer’s Office
7.1.2 Precompliance Testing
7.1.3 Performing Precompliance Analysis
7.1.4 Formal EMC Qualification Tests
7.1.5 Instrumentation Error
7.1.6 In Situ Testing of Systems and Installations
7.2 Immunity/Susceptibility Tests
7.2.1 Radiated Immunity
7.2.1.1 Modulation
7.2.1.2 Harmonic Issues
7.2.1.3 Monitoring of Immunity Field Level
7.2.2 Electrostatic Discharge
7.2.2.1 General Information
7.2.2.2 ESD Waveforms
7.2.2.3 Triboelectric Series
7.2.2.4 Typical Test Setup
7.2.2.5 EUT Performance Criteria
7.2.2.6 Diagnosis and Fixes
7.2.2.7 Concerns Related to Analyzing ESD Events
7.2.2.8 Alternative ESD Test Simulator
7.2.2.9 Other Uses for ESD Simulator
7.2.2.10 Sensing ESD Events within One’s Environment
7.2.3 Power Frequency Magnetic Field Disturbance
7.2.3.1 General Conditions
7.2.3.2 EUT Performance Criteria
7.2.3.3 Typical Test Setup
7.2.3.4 Waveform Verification
7.2.3.5 Performing the Test
References
8 General Approaches to Troubleshooting
8.1 General System Testing and Troubleshooting
8.1.1 Emission Testing
8.1.2 Immunity Testing
8.1.3 In Situ Testing
8.2 Potential Problems During Testing and Troubleshooting
8.3 Testing and Troubleshooting Concerns
8.3.1 Systematic Approach for Emission Testing and  
Troubleshooting
8.3.2 Systematic Approach for Immunity Testing and  
Troubleshooting
8.3.3 Systematic Approach to Detecting and Locating Problems
8.3.4 Minimum Requirements for Performing EMC Tests
8.4 Repeatability of System Testing
8.5 Unexpected Problems after Production Has Begun
8.6 Creative Approaches to Troubleshooting (Case Studies)
References
9 On-Site Troubleshooting Techniques
9.1 Quick Fixes and Solutions
9.1.1 Conducted Solutions
9.1.2 Radiated Solutions
9.1.3 Crosstalk Solutions
9.2 Simplified Troubleshooting Techniques
9.2.1 The “Plain Wave and Standing Wave” Technique
9.2.2 The “Disabling-the-System” Technique
9.2.3 The “Cable Disconnection” Technique
9.2.4 The “Sticky Finger” Debugging Tool
9.2.5 The “Sharpen-Your-Pencil” Tool
9.2.6 The “Coolant Spray” Tool
9.2.7 The “Piece-of-Wire” Approach
9.2.8 The “Radio Control Race Car Diagnostic Sensor
9.2.9 The “Tin Can Wireless Antenna” for Signals above 1 GHz
9.3 Testing and Troubleshooting Using Probes 301
9.3.1 Using Probes for Immunity Testing and Troubleshooting
9.3.2 Differential Measurement of RF Currents on Cables  
and Interconnects
9.3.3 Switching Power Supply Effects on Common-Mode  
Conducted Noise
9.3.4 Discrete Component Diagnostic Tool
9.3.5 Tweezers Probe
9.3.6 Miniature High-Discrimination Probe
9.3.7 Using Current Probe as Substitute for Radiated  
Emission Testing
9.3.8 Enclosure Resonances and Shielding Effectiveness
9.4 Alternate Troubleshooting Techniques
9.4.1 Using Oscilloscope to Debug Signal Integrity Waveforms  
and Radiated Emissions
9.4.2 Using Inexpensive Receivers for Emissions Testing
9.4.3 Using Amateur Radio Transmitter for Immunity Testing
9.4.4 Radiated Problem Masked as Conducted Emission Problem
9.4.5 Determining Whether Conducted Emission Noise is  
Differential Mode or Common Mode
9.4.6 Another Use of EFT/B Generator
9.4.7 Signal Integrity Observations
9.5 System-Level Troubleshooting
9.5.1 Switching Power Supplies—Measuring Magnetic  
Field Coupling
9.5.2 Potential Problems When Using Ferrite Cores—Increase  
in Radiated Emissions
9.5.3 Measuring Shielding Effectiveness of Materials
and Enclosures
9.5.4 Measuring Effects of High-Frequency Noise Currents  
in Equipment
9.5.5 Measuring Noise Voltage across Seams in Enclosures
9.6 Ambient Cancellation or Suppression
9.7 Printed Circuit Board Diagnostic Scanners
References

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 楼主| 发表于 2008-9-15 23:52:36 | 显示全部楼层

上传完毕!

终于上传完毕!
发表于 2008-10-11 16:56:29 | 显示全部楼层
thanks of your sharing
发表于 2008-12-13 15:31:12 | 显示全部楼层

haoshu

好书,当看看
发表于 2008-12-19 14:26:45 | 显示全部楼层
谢谢楼主分享。太好了。
发表于 2008-12-19 16:33:00 | 显示全部楼层
原来是测试的标准和方法。多谢。
发表于 2009-2-22 10:30:20 | 显示全部楼层

There is no fault to share.The more, the better

Share is the most valuable in human knowledge progress. Many Thks!
发表于 2009-2-22 10:36:00 | 显示全部楼层

Valuable Data

If there
发表于 2009-2-22 11:01:14 | 显示全部楼层

Valuable data

If you want to dance with wolves, you must act like a wolf. Chinese have spent 100 years to learn one simple fact: Inferior leads to be defeated. China's fast development is in a precious wonderful and peaceful environment. No wars, no nature disasters. From the view point of history, this peaceful period window, maybe, is the only possibility for China to say godbye to poverty, inferiority. And, take the lead role in world.

I recommend young engineers to read original english technical book here. A simple fact is that, all the translated version is knowledge or view scale limited by the translator. That means what you can get from this book is deeply depend on the experience and expert skills of the translator. So, it is a good idea to read the original book, no matter it is a e-book or a printed. Maybe you feel difficult at the beginning. But, if you keep this habit within your career lifetime, I believe you can get what you want.

Thanks again the non-selfish sharing.
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