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本帖最后由 Jason.tschen 于 2016-5-31 17:46 编辑
3D IC Stacking Technology by Banqiu Wu
by Banqiu Wu, Ajay Kumar, Sesh Ramaswami
Hardcover: 544 pages
Publisher: McGraw-Hill Education; 1 edition (July 28, 2011)
Language: English
ISBN-10: 007174195X
ISBN-13: 978-0262691277
MH-3D-IC-Stacking-Technology.pdf
(13.29 MB, 下载次数: 314 )
About the Author
Banqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored several books, including Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds multiple patents and awards.
Dr. Ajay Kumar is Vice President and General Manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals including several review articles. Dr. Kumar co-authored the book Extreme Ultraviolet Lithography. He holds more than 100 US patents and has won many awards for innovation and commercialization.
Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.
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发表于 2016-5-31 05:46:00
