电子产品可靠性设计的好书

pengruojing

Preface
1. Introduction to Reliability
1.1 What Is Reliability?
1.2 Discipline and Tasks Involved with Product Reliability
1.3 The Bathtub Failure Rate Curve
1.4 Reliability Goals and Metrics
1.5 Reliability Prediction
1.6 Reliability Risk
1.7 Reliability Growth
1.8 Reliability Degradation
1.9 Reliability Challenges
1.10 Reliability Trends
References
2. Basic Reliability Mathematics
2.1 Statistical Terms
2.2 Statistical Distributions
2.3 Plotting and Linearization of Data
2.4 Confidence Limit and Intervals
2.5 Failure Free Operation
2.6 Reliability Modeling
Copyright 2003 by Marcel Dekker, Inc. All Rights Reserved.
x Preface
2.7 Practical MTBF and Warranty Cost Calculations
Reference
Appendix A
3. Robust Design Practices
3.1 Introduction
3.2 Concurrent Engineering/Design Teams
3.3 Product Design Process
3.4 Translate Customer Requirements to Design Requirements
3.5 Technology Assessment
3.6 Circuit Design
3.7 Power Supply Considerations
3.8 Redundancy
3.9 Component/Supplier Selection and Management
3.10 Reliability Prediction
3.11 Support Cost and Reliability Tradeoff Model
3.12 Stress Analysis and Part Derating
3.13 PCB Design, PWA layout, and Design for Manufacture
3.14 Thermal Management
3.15 Signal Integrity and Design for Electromagnetic
Compatibility
3.16 Design for Test
3.17 Sneak Circuit Analysis
3.18 Bill of Material Reviews
3.19 Design Reviews
3.20 The Supply Chain and the Design Engineer
3.21 Failure Modes and Effects Analysis
3.22 Design for Environment
3.23 Environmental Analysis
3.24 Development and Design Testing
3.25 Transportation and Shipping Testing
3.26 Regulatory Testing
3.27 Design Errors
References
Further Reading
4. Component and Supplier Selection, Qualification, Testing,
and Management
4.1 Introduction
4.2 The Physical Supply Chain
4.3 Supplier Management in the Electronics Industry
Copyright 2003 by Marcel Dekker, Inc. All Rights Reserved.
Contents xi
4.4 The Role of the Component Engineer
4.5 Component Selection
4.6 Integrated Circuit Reliability
4.7 Component Qualification
References
Further Reading
Appendix A: Supplier Scorecard Process Overview
Appendix B: Self-Qualification Form for Programmable
Logic ICs
5. Thermal Management
5.1 Introduction
5.2 Thermal Analysis Models and Tools
5.3 Impact of High-Performance Integrated Circuits
5.4 Material Considerations
5.5 Effect of Heat on Components, Printed Circuit Boards,
and Solder
5.6 Cooling Solutions
5.7 Other Considerations
References
Further Reading
6. Electrostatic Discharge and Electromagnetic Compatibility
6.1 Electrostatic Discharge
6.2 Electromagnetic Compatibility
Further Reading
7. Manufacturing/Production Practices
7.1 Printed Wiring Assembly Manufacturing
7.2 Printed Wiring Assembly Testing
7.3 Environmental Stress Testing
7.4 System Testing
7.5 Field Data Collection and Analysis
7.6 Failure Analysis
References
Further Reading
8. Software
8.1 Introduction
8.2 Hardware/Software Development Comparison
8.3 Software Availability
Copyright 2003 by Marcel Dekker, Inc. All Rights Reserved.
xii Preface
8.4 Software Quality
Reference
Appendix A: An Example of Part Derating Guidelines
Appendix B: FMEA Example for a Memory Module
Epilogue

pengruojing

自己现顶一下

xuxms

表示先下载再发表意见

kinlin

细细品味一下老外的好书籍

Richard.Li

下载，体会一下老外的技术资料

walterqin

学习下，不知道能不能弄明白

pengruojing

做产品的（非学术研究的），你们该看看这本书。

molf1998

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cicixu

谢谢楼主

wjh_yw

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