工艺: GaAs MESFET, HBT, PHEMT; SiGe HBT; GaN HFET; Si RFCMOS 90nm,130nm ..
foundries: WIN SEMI, TRIQUINT, GCS, JAZZ,IBM,
工具: ADS, AWR, Cadnence
封装、测试: >10 years good relationship with package and testing house
Release Products: 2G, 3G cell phone PA module, WiFi/WiMax Front End Module,
Cordless phone PA module, GPS Low Noise Amplifier, CATV power amplifier,
CMOS Controller, LED driver......