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【Morgan Kaufmann System on silicon 2009】3-D integrated circuit design

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发表于 2009-2-25 21:50:48 | 显示全部楼层 |阅读模式

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【Morgan Kaufmann System on silicon 2009】

3-D integrated circuit design

Morgan Kaufmann Publishers is an imprint of Elsevier.
30 Corporate Drive, Suite 400, Burlington, MA 01803, USA
This book is printed on acid-free paper.
# 2009 by Elsevier Inc. All rights reserved.

Preface
The seminal reason for this book is the lack of a unified treatment of the design of
three-dimensional integrated circuits despite the significant progress that has recently
been achieved in this exciting new technology. Consequently, the intention of this
material is to cohesively integrate and present research milestones from different, yet
interdependent, aspects of three-dimensional integrated circuit design. The foremost
goal of the book is to propose design methodologies for 3-D circuits; methodologies
that will effectively exploit the flourishing manufacturing diversity existing in three-
dimensional integration. While the focal point is design techniques and methodologies,
the material also highlights significant manufacturing strides that complete the research
mosaic of three-dimensional integration.
Three-dimensional or vertical integration is an exciting path to boost the performance
and extend the capabilities of modern integrated circuits. These capabilities are inherent
to three-dimensional integrated circuits. The former enhancement is due to the consid-
erably shorter interconnect length in the vertical direction and the latter is due to the
ability to combine dissimilar technologies within a multi-plane system. It is also worth
noting that vertical integration is particularly compatible with the integrated circuit
design process that has been developed over the past several decades. These distinctive
characteristics make three-dimensional integration highly attractive as compared to
other radical technological solutions that have been proposed to resolve the increas-
ingly difficult issue of on-chip interconnect.


由于网速很慢很慢,所以分成几个文件!

[ 本帖最后由 vertyang 于 2009-2-25 23:21 编辑 ]
dimensional integrated circuit design.jpg

three-dimensional integrated circuit design.part1.rar

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three-dimensional integrated circuit design.part2.rar

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 楼主| 发表于 2009-2-25 23:11:05 | 显示全部楼层
终于传完了,网速太慢了,大家多回几个帖子,就可以把信元挣回来啦
发表于 2009-2-26 08:13:27 | 显示全部楼层
正想找这方面的材料。多谢。
发表于 2009-2-26 09:32:38 | 显示全部楼层
发表于 2009-2-26 09:34:21 | 显示全部楼层
发表于 2009-2-26 09:39:53 | 显示全部楼层
发表于 2009-2-26 10:05:25 | 显示全部楼层
顶一个,好东西
发表于 2009-2-26 10:13:29 | 显示全部楼层
qqqqqqqqqqqqqqqqqqqq
发表于 2009-2-26 10:23:53 | 显示全部楼层
发表于 2009-2-26 10:26:49 | 显示全部楼层
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