Right the First Time, A Practical Handbook on High Speed PCB and System Design

cx2006 · 发表于 2010-8-20 18:19:52

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Right the First Time, A Practical Handbook on High Speed PCB and System Design

cx2006 · 发表于 2010-8-20 18:21:33

Right the First Time v1

cx2006 · 发表于 2010-8-20 18:24:46

Right the First Time V1

cx2006 · 发表于 2010-8-20 18:28:08

Right the First Time V2-V6

kkzm · 发表于 2010-8-20 20:28:08

系统集成

chujn · 发表于 2010-8-21 12:12:21

下来看看，谢谢。

cx2006 · 发表于 2010-8-23 09:04:33

Right the First Time: A Practical Handbook On High Speed PCB and System Design
Chapters 1-48
Chapter 1: Introduction
Chapter 2: The Electrical Engineering Problem
Chapter 3: Major Elements in an Electronic System
Chapter 4: Assumptions Often Made About Electronic Systems
Chapter 5: How Real Systems and Their Components Are Far From Ideal
Chapter 6: Transmission Lines
Chapter 7: What’s Moving on a Transmission Line?
Chapter 8: Basics of Electromagnetic Fields
Chapter 9: Digital vs. Rf/Microwave vs. Analog
Chapter 10: Time and Distance
Chapter 11: Inductance
Chapter 12: Capacitance
Chapter 13: Resistance
Chapter 14: Fundamentals of Transmission Lines
Chapter 15: The Concept of Ground and Power Planes
Chapter 16: Impedance
Chapter 17: Reflections – What Causes Them and What They Do to a Signal
Chapter 18: What is Meant by Signal Integrity Engineering
Chapter 19: When is a Design High-Speed?
Chapter 20: Controlling Reflections By Using Terminations
Chapter 21: Terminator Type, Terminator Placement and Net Sequencing
Chapter 22: Stubs on Transmission Lines?
Chapter 23: Properties of Transmission Lines That Affect Impedance
Chapter 24: Methods For Calculating and Measuring Impedance
Chapter 25: Right-Angle Bends and Vias: Potential Sources of Reflections and Other Problems
Chapter 26: Types of Drivers or Sources
Chapter 27: Types of Loads
Chapter 28: Bus Protocols
Chapter 29: Crosstalk or Coupling?
Chapter 30: Single-Ended Signaling
Chapter 31: Differential Signaling
Chapter 32: The Power Subsystem
Chapter 33: Power Distribution DC Drop
Chapter 34: Decoupling Capacitors
Chapter 35: Power Subsystem Inductance
Chapter 36: Power Dissipation Estimate
Chapter 37: Example Power Subsystem Design
Chapter 38: IC Packages – Vcc and Ground Bounce or SSN
Chapter 39: Noise Margins
Chapter 40: Design Rule Creation Using Noise Margin Analysis
Chapter 41: The PCB Fabrication Process
Chapter 42: PCB Materials
Chapter 43: Creating PCB Stackups
Chapter 44: Types of Vias
Chapter 45: PCB Design Process
Chapter 46: PCB Routing
Chapter 47: Documentation
Chapter 48: The Ideal Component Data Sheet