IPC-7351A Naming Convention

wanghanq

IPC-7351B Naming Convention for Standard SMT Land Patterns
Surface Mount Land Patterns
Component, Category Land Pattern Name
Ball Grid Array’s ............................... BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height
BGA w/Dual Pitch . BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height
BGA w/Staggered Pins .................. BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height
BGA Note: The C or N = Collapsing or Non-collapsing Balls
Capacitors, Chip, Array, Concave .......................................................... CAPCAV + Pitch P + Body Length X Body Width X Height - Pin Qty
Capacitors, Chip, Array, Flat .................................................................. CAPCAF + Pitch P + Body Length X Body Width X Height - Pin Qty
Capacitors, Chip, Non-polarized ................................................................................................. CAPC + Body Length + Body Width X Height
Capacitors, Chip, Polarized ..................................................................................................... CAPCP + Body Length + Body Width X Height
Capacitors, Chip, Wire Rectangle ........................................................................................ CAPCWR + Body Length + Body Width X Height
Capacitors, Molded, Non-polarized ........................................................................................... CAPM + Body Length + Body Width X Height
Capacitors, Molded, Polarized ................................................................................................. CAPMP + Body Length + Body Width X Height
Capacitors, Aluminum Electrolytic ............................................................................................................ CAPAE + Base Body Size X Height
Ceramic Flat Packages..................................................................................................... CFP127P + Lead Span Nominal X Height - Pin Qty
Column Grid Array’s ..................................................... CGA + Pitch P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
Crystals (2 leads) ........................................................................................................................ XTAL + Body Length X Body Width X Height
Dual Flat No-lead .......................................................................................................... DFN + Body Length X Body Width X Height – Pin Qty
Diodes, Chip ............................................................................................................................... DIOC + Body Length + Body Width X Height
Diodes, Molded ........................................................................................................................... DIOM + Body Length + Body Width X Height
Diodes, MELF ............................................................................................................................... DIOMELF + Body Length + Body Diameter
Diodes, Side Concave ............................................................................................... DIOSC + Body Length X Body Width X Height - Pin Qty
Fuses, Molded ............................................................................................................................ FUSM + Body Length + Body Width X Height
Inductors, Chip ............................................................................................................................. INDC + Body Length + Body Width X Height
Inductors, Molded ........................................................................................................................ INDM + Body Length + Body Width X Height
Inductors, Precision Wire Wound ................................................................................................ INDP + Body Length + Body Width X Height
Inductors, Chip, Array, Concave .............................................................. INDCAV + Pitch P + Body Length X Body Width X Height - Pin Qty
Inductors, Chip, Array, Flat ...................................................................... INDCAF + Pitch P + Body Length X Body Width X Height - Pin Qty
Land Grid Array, Circular Lead .................. LGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height
Land Grid Array, Square Lead ................... LGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height
Land Grid Array, Rectangle Lead .............. LGA + Pin Qty + R + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height

turnfey

好资料呀，感谢楼主分享

wumingli1985

lz有没有搞错啊，这不是ipc资料啊，浪费我的钱

Ellen_wh

回复 3# wumingli1985
确实发的有问题，不是IPC7351A